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Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow |
Kyung-Hwan Lim, Minsu Lee, Tai Hong Yim, Seok Seo, Kyung-Woo Yi |
J. Electrochem. Sci. Technol. 2019;10(4):408-415. Published online October 24, 2019 DOI: https://doi.org/10.33961/jecst.2019.02894 |
Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow A new particle image velocimetry technique for three-dimensional full field fluid flow measurement in evaporating films A finite volume technique to simulate the flow of a viscoelastic fluid A new modeling for 3D Carreau fluid flow considering nonlinear thermal radiation Stochastic modeling of surface scalar-flux fluctuations in turbulent channel flow using one-dimensional turbulence Blood Analog Fluid Flow in Vessels with Stenosis: Development of an Openfoam Code to Simulate Pulsatile Flow and Elasticity of the Fluid Development of hybrid method for coupled conduction-radiation heat transfer in two-dimensional irregular enclosure considering thermo-radiative effects and varying thermal conductivity Modeling of the Electroplating of a ThroughâHole Considering Additive Effects and Convection Three-dimensional and heat-loss effects on turbulent flow in a nominally two-dimensional cavity On fluid-to-fluid modeling of film boiling heat transfer using dimensional analysis |