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Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow
- Kyung-Hwan Lim, Minsu Lee, Tai Hong Yim, Seok Seo, Kyung-Woo Yi
- J. Electrochem. Sci. Technol. 2019;10(4):408-415. Published online October 24, 2019
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DOI: https://doi.org/10.33961/jecst.2019.02894Web of Science 1 Scopus 2
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