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Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow
Kyung-Hwan Lim, Minsu Lee, Tai Hong Yim, Seok Seo, Kyung-Woo Yi
J. Electrochem. Sci. Technol. 2019;10(4):408-415.   Published online October 24, 2019
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